南宫

On March 17 local time, OFC 2026, the world's premier event for the global optical communications industry, kicked off with grandeur in California, USA. EverProX unveiled its innovative products and solutions for the two core sectors of telecommunications and data centers at the exhibition, attracting widespread industry attention.

Deep Roots in Telecommunications, Solidifying Full-Scenario Access Capabilities

As a seasoned player in the PON optical transceiver sector, EverProX offers a full product portfolio covering EPON, GPON, 10G PON and the next-generation 50G PON, with maximum support for 50G tri-mode single-fiber six-way data links. This comprehensive product matrix demonstrates EverProX's strong capabilities in delivering global carriers with diversified, highly reliable access layer solutions spanning from existing network upgrades to future technology evolution, laying a solid connectivity foundation for the intelligent world of the Internet of Everything.

Rising to AI Challenges, Full Upgrade of Data Center Solutions

EverProX showcased a lineup of highly sought-after data center products, including the Openpel high-density patching system, in-house developed SN-MT series, MPO/MTP pre-terminated optical cables, 800G optical transceivers, and 1.6T AECs. Backed by ultra-high-density deployment capability, as well as ultra-low latency and high reliability guaranteed by state-of-the-art optical design, these products deliver robust support for the stable and efficient operation of AI clusters, drawing intense attention from a large number of exhibition attendees.

Grand Launch of Full-Line Fiber Array Unit (FAU) Product Portfolio

The biggest highlight from EverProX at this year's OFC is the grand launch of its full-line Fiber Array Unit (FAU) products. These products not only cater to the mass demand for current 400G/800G optical transceivers, but also feature a forward-looking layout aligned with the evolution trend of low-power, high-density, integrated optical interconnects for future AI clusters. The three-series product matrix clearly outlines the cutting-edge layout of Changxin Bochuang (EverProX) in the data communication sector:

Standard FA Series: The Backbone for 400G/800G Optical Transceivers

The industry is currently at a critical juncture where 400G is seeing large-scale deployment and 800G is ramping up rapidly. As a core component for fiber array coupling inside optical transceivers, the precision, reliability and cost of FA directly determine the overall performance of the transceiver.

EverProX provides a full range of FA products for 400G/800G applications, including high-density single-mode/multimode FA and polarization-maintaining (PM) FA, with core advantages as follows:

• Sub-micron level fiber positioning accuracy for guaranteed low insertion loss;

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• Superior environmental stability, fully compatible with mainstream silicon optical modulators and receiver chips;

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• Standardized plug-and-play design to help transceiver manufacturers quickly roll out MSA-compliant products.

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2D FAU Solution for OCS: End-to-End Capability from Core Components to System Integration

OCS enables flexible switching of optical beams between input and output fibers via a 2D MEMS mirror array, imposing extremely stringent requirements on the 2D arrangement accuracy, material matching and optical integration capability of the fiber array.

EverProX presented a complete end-to-end technical roadmap from substrates (Si/Glass) to 2D FAU arrays, optical engines, and even complete equipment. Its core advantages include:

• Independent and controllable 2D FAU design, customization and processing capabilities, supporting high density, high precision, high reliability and wide-angle deflection;

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• In-depth optical matching with mainstream MEMS solutions to ensure low insertion loss and high stability;

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• Proven experience in core component and subsystem integration for OCS system-level commissioning, accelerating customers' product development cycles.

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FAU Product Portfolio for CPO: Forward-Looking Layout for "Silicon-Centric" Architectures

CPO, which co-packages optical engines with computing chips, poses brand-new challenges to the form factor, reliability and maintainability of fiber arrays. To address these challenges, EverProX has launched a series of innovative FAU products:

• Hermetic FA: Ideal for laser integration scenarios, it protects sensitive optical interfaces through hermetic packaging to enhance long-term reliability;

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• Detachable FA: Supports repeated on-site plugging and unplugging, balancing high-density deployment with ease of maintenance;

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• Mode Field Converting FA: Enables low-loss coupling between silicon waveguides and standard fibers via end-face mode field matching technology, a key enabling technology for silicon photonic CPO;

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• Multi-Core FA: Supports fan-in/fan-out for multi-core fibers (MCF), laying the foundation for interconnect density enhancement via future space division multiplexing (SDM).

From comprehensive coverage of telecom access, to high-speed interconnects within data centers, and to the forward-looking FAU technology layout for the OCS and CPO era, EverProX's technical team held in-depth discussions with global customers and partners throughout the three-day exhibition, sharing insights into the evolution of optical interconnect technology.